Manufacturer Part Number | FDS6875 |
---|---|
Future Part Number | FT-FDS6875 |
SPQ / MOQ | Contact Us |
Packing Material | Reel/Tray/Tube/Others |
Series | PowerTrench® |
FDS6875 Status (Lifecycle) | In Stock |
Part Status | Active |
FET Type | 2 P-Channel (Dual) |
FET Feature | Logic Level Gate |
Drain to Source Voltage (Vdss) | 20V |
Current - Continuous Drain (Id) @ 25°C | 6A |
Rds On (Max) @ Id, Vgs | 30 mOhm @ 6A, 4.5V |
Vgs(th) (Max) @ Id | 1.5V @ 250µA |
Gate Charge (Qg) (Max) @ Vgs | 31nC @ 5V |
Input Capacitance (Ciss) (Max) @ Vds | 2250pF @ 10V |
Power - Max | 900mW |
Operating Temperature | -55°C ~ 150°C (TJ) |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154", 3.90mm Width) |
Supplier Device Package | 8-SOIC |
Country of Origin | USA/JAPAN/MALAYSIA/MEXICO/CN |
FDS6875 Weight | Contact Us |
Replacement Part Number | FDS6875-FT |
FDC6322C
ON Semiconductor
FDC6432SH
ON Semiconductor
NDC7002N_SB9G007
ON Semiconductor
USB10H
ON Semiconductor
FDJ1027P
ON Semiconductor
FDJ1028N
ON Semiconductor
FDJ1032C
ON Semiconductor
FDQ7698S
ON Semiconductor
FDMJ1032C
ON Semiconductor
FDMC6890NZ
ON Semiconductor
XC6SLX150-3FG900C
Xilinx Inc.
APA450-FG484A
Microsemi Corporation
A54SX16-1VQG100
Microsemi Corporation
EP2S30F672C5N
Intel
EP20K200EFC672-2X
Intel
10M16DAF256I6G
Intel
5SGXEA7N3F45I3LN
Intel
XC4003E-4PC84I
Xilinx Inc.
AGL400V5-FG144I
Microsemi Corporation
A40MX04-3PQG100
Microsemi Corporation